DocumentCode :
3328097
Title :
An experimental investigation of 4-layer printed circuit board decoupling
Author :
Hubing, T. ; Van Doren, T. ; Sha, F. ; Drewniak, J. ; Wilhelm, M.
Author_Institution :
Electromagnetic Compatibility Lab., Missouri Univ., Rolla, MO, USA
fYear :
195
fDate :
14-18 Aug 195
Firstpage :
308
Lastpage :
312
Abstract :
This paper examines the measured power bus impedance of fully populated 4-layer printed circuit boards with internal power and ground planes. Three boards provided by two leading computer companies were evaluated. Each of the state-of-the-art high-speed boards used in this study employed surface-mount decoupling capacitors to reduce noise on the power bus. The boards were measured with and without some or all of their decoupling capacitance. The effectiveness of the decoupling capacitors as a function of location and frequency and the relationship between board impedance and power bus noise was explored. The behavior of 4-layer boards is shown to be quite different than that of boards without planes or boards with closely spaced planes
Keywords :
capacitors; electric impedance measurement; electric noise measurement; printed circuit testing; surface mount technology; 4-layer printed circuit board decoupling; experimental investigation; frequency; ground planes; high-speed boards; internal power; location; measured power bus impedance; noise reduction; power bus noise; surface-mount decoupling capacitors; Circuit testing; Distributed parameter circuits; Frequency; Inductance; Noise measurement; Power measurement; Power transmission lines; Printed circuits; Spectral analysis; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1995. Symposium Record., 1995 IEEE International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3608-9
Type :
conf
DOI :
10.1109/ISEMC.1995.523569
Filename :
523569
Link To Document :
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