Title :
A probe scheduling algorithm for MCM substrates
Author :
Kim, Bruce C. ; Jiang, Pinshan ; Park, Se Hyun
Author_Institution :
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Abstract :
In this paper we propose an efficient algorithm for scheduling a flying test probe for unpopulated MCM substrates. Our objective is to reduce the total time of MCM substrate testing by optimizing the traveling path of the probe. This paper first describes two algorithms: Lin-Kernighan (LK) and Simulated Annealing (SA). We then discuss our proposed algorithm which is the combination of SA and LK to optimize scheduling of the flying test probe. The algorithm is based on the single-ended probe testing method. We applied the algorithms to a real MCM substrate and obtained satisfactory low-cost results
Keywords :
circuit CAD; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; multichip modules; simulated annealing; substrates; travelling salesman problems; CAD tool; Lin-Kernighan algorithm; MCM substrates; flying test probe; interconnect; laminate substrate; low-cost results; optimized probe traveling path; probe scheduling algorithm; random netlist; scheduling; sequence exchange; simulated annealing; single-ended probe testing method; testing time reduction; traveling salesman problem; unpopulated substrates; Costs; Electronic equipment testing; Electronics packaging; Multichip modules; Probes; Processor scheduling; Scheduling algorithm; Semiconductor device testing; Simulated annealing; Substrates;
Conference_Titel :
Test Conference, 1999. Proceedings. International
Conference_Location :
Atlantic City, NJ
Print_ISBN :
0-7803-5753-1
DOI :
10.1109/TEST.1999.805611
