• DocumentCode
    3328533
  • Title

    Multi-physics simulations with vorpal

  • Author

    Smithe, David ; Stoltz, Peter ; Lin, Ming-Chieh ; Karipides, Dan ; Wang, Haipeng ; Tian, Kai ; Cheng, Gary

  • Author_Institution
    Tech-X Corp., Boulder, CO, USA
  • fYear
    2010
  • fDate
    20-24 June 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. The VORPAL finite-difference time-domain particle-in-cell simulation tool has traditionally been used for accelerator, electromagnetic, and plasma simulations. Approximately two years ago, a generalized PDE (partial differential equation) capability was added to the software, and we are now developing this capability to provide multi-physics simulations capability. Our project focus is on integrated thermal & electromagnetic simulations for superconducting RF accelerators. But we are interested in broadening the scope of applications to include vacuum electronics and other physical processes in addition to EM and thermal. We present benchmarking exercises comparing the VORPAL simulations to experimental measurement, and to other multi-physics software. We also benchmark with experiment additional simulations of a complex 3-D feed-through structure for an HOM coupler.
  • Keywords
    finite difference time-domain analysis; plasma accelerators; plasma simulation; plasma transport processes; HOM coupler; VORPAL simulation; complex 3-D feed-through structure; electromagnetic simulation; finite-difference time-domain particle-in-cell simulation; multiphysics simulation; partial differential equation; physical process; plasma simulation; superconducting RF accelerators; thermal simulation; vacuum electronics; Application software; Electromagnetic measurements; Finite difference methods; Partial differential equations; Particle accelerators; Plasma accelerators; Plasma simulation; Radio frequency; Software measurement; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2010 Abstracts IEEE International Conference on
  • Conference_Location
    Norfolk, VA
  • ISSN
    0730-9244
  • Print_ISBN
    978-1-4244-5474-7
  • Electronic_ISBN
    0730-9244
  • Type

    conf

  • DOI
    10.1109/PLASMA.2010.5533963
  • Filename
    5533963