DocumentCode
3328533
Title
Multi-physics simulations with vorpal
Author
Smithe, David ; Stoltz, Peter ; Lin, Ming-Chieh ; Karipides, Dan ; Wang, Haipeng ; Tian, Kai ; Cheng, Gary
Author_Institution
Tech-X Corp., Boulder, CO, USA
fYear
2010
fDate
20-24 June 2010
Firstpage
1
Lastpage
1
Abstract
Summary form only given. The VORPAL finite-difference time-domain particle-in-cell simulation tool has traditionally been used for accelerator, electromagnetic, and plasma simulations. Approximately two years ago, a generalized PDE (partial differential equation) capability was added to the software, and we are now developing this capability to provide multi-physics simulations capability. Our project focus is on integrated thermal & electromagnetic simulations for superconducting RF accelerators. But we are interested in broadening the scope of applications to include vacuum electronics and other physical processes in addition to EM and thermal. We present benchmarking exercises comparing the VORPAL simulations to experimental measurement, and to other multi-physics software. We also benchmark with experiment additional simulations of a complex 3-D feed-through structure for an HOM coupler.
Keywords
finite difference time-domain analysis; plasma accelerators; plasma simulation; plasma transport processes; HOM coupler; VORPAL simulation; complex 3-D feed-through structure; electromagnetic simulation; finite-difference time-domain particle-in-cell simulation; multiphysics simulation; partial differential equation; physical process; plasma simulation; superconducting RF accelerators; thermal simulation; vacuum electronics; Application software; Electromagnetic measurements; Finite difference methods; Partial differential equations; Particle accelerators; Plasma accelerators; Plasma simulation; Radio frequency; Software measurement; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2010 Abstracts IEEE International Conference on
Conference_Location
Norfolk, VA
ISSN
0730-9244
Print_ISBN
978-1-4244-5474-7
Electronic_ISBN
0730-9244
Type
conf
DOI
10.1109/PLASMA.2010.5533963
Filename
5533963
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