DocumentCode :
332889
Title :
The rise and fall of the ATE industry
Author :
Rockoff, Todd
Author_Institution :
SIMD Solutions Inc., USA
fYear :
1998
fDate :
18-23 Oct 1998
Firstpage :
1154
Abstract :
For the semiconductor industry to continue to achieve its product quality and life cycle goals, ATE manufacturers need to re-think system architecture. Conventional ATE system software creates an initial state for the complex digital circuits that execute a test, and later reports results. But during the execution of a test, conventional ATE system software lies inactive, awaiting completion of the test system hardware´s arcane dance. If the ATE manufacturers are able to draw on the lessons learned over several decades in the parallel computing industry, then future ATE will include system software that manages test system hardware resources dynamically at a fine grain throughout test execution. Such flexibility of test system operation is an improvement dimension that is not reflected in the SIA Roadmap. Flexibility opens the door to increased functional capability, reduced time-to-market for families of ATE, reduced hardware costs, and simplified test development. Improvement in this new dimension will allow ATE to achieve the SIA´s long-term performance projections
Keywords :
automatic test equipment; automatic test software; electronics industry; integrated circuit testing; ATE industry; ATE manufacturers; ATE system software; SIA Roadmap; increased functional capability; life cycle goals; long-term performance projections; product quality; reduced hardware costs; reduced time-to-market; semiconductor industry; simplified test development; system architecture; test system hardware resources; test system operation flexibility; Circuit testing; Computer architecture; Digital circuits; Electronics industry; Hardware; Manufacturing industries; Semiconductor device manufacture; Software testing; System software; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-5093-6
Type :
conf
DOI :
10.1109/TEST.1998.743353
Filename :
743353
Link To Document :
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