DocumentCode
3329175
Title
Formulating MITF for a Multicore Processor with SEU Tolerance
Author
Funaki, Toshimasa ; Sato, Toshinori
fYear
2008
fDate
3-5 Sept. 2008
Firstpage
234
Lastpage
241
Abstract
While shrinking geometries of embedded LSI devices is beneficial for portable intelligent systems, it is increasingly susceptible to influences from electrical noise, process variation, and natural radiation interference. Even in consumer applications, modern embedded devices should be protected by dependable technologies. The challenging issue is there is a severe constraint in power consumption. As a platform to investigate the dependability, power, and performance trade-off, multiple clustered core processor (MCCP) is being investigated. It is a homogeneous multicore processor and has configurability in scale, which is beneficial for considering the trade-off. This paper focuses on how to explore the trade-off, and proposes to use mean instructions to failure (MITF) as a metric. To the best of our knowledge, this is the first study that formulates MITF for multicore processors. We compare three redundancy modes; undependable, thread-level redundancy, and instruction-level redundancy modes based on detailed simulations. As expected, thread-level redundancy shows largest MITF.
Keywords
multiprocessing systems; homogeneous multicore processor; instruction-level redundancy modes; mean instructions to failure; multiple clustered core processor; natural radiation interference; performance trade-off; portable intelligent systems; power consumption; process variation; thread-level redundancy; undependable redundancy; Breakdown voltage; Design methodology; Digital systems; Energy consumption; Geometry; Large scale integration; Multicore processing; Performance gain; Redundancy; Single event upset; instruction-level redundancy; soft error problem; thread-level redundancy;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital System Design Architectures, Methods and Tools, 2008. DSD '08. 11th EUROMICRO Conference on
Conference_Location
Parma
Print_ISBN
978-0-7695-3277-6
Type
conf
DOI
10.1109/DSD.2008.48
Filename
4669242
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