Title : 
Validation in Internet Survey Research: Reviews and Future Suggestions
         
        
            Author : 
Wang, Hui-Chih ; Doong, Her-Sen
         
        
            Author_Institution : 
Nat. Chung Chen Univ., Ming-Hsiung
         
        
        
        
            Abstract : 
In recent years, Internet surveys have been widely used by researchers and companies as a means of data collection. However, few IS studies have discussed the validation of Internet survey research. From the perspective of the positivist and quantitative research, studies that fail to organize a scientific and rigorous research design will harm their finding´s validity, reliability and generalizability. In turn; their contributions to the literature and implications for business are limited. Building on a review of past marketing research studies which were well-developed in Internet survey methodological validation, this study illustrated nine issues for IS researchers to re-consider in their empirical Internet surveys. Alternative ways to enhance the necessary rigor of the survey quality in term of the Internet survey types, population, and pros./cons, of each survey type were also proposed. This paper should serve as a useful guide for IS researchers in the planning and execution of an Internet survey, or in judging the inferential ability of other Internet survey research
         
        
            Keywords : 
Internet; information systems; market research; Internet survey research validation; data collection; information systems; Buildings; Costs; Electronic commerce; Information systems; Instruments; Internet telephony; Market research; Postal services; Technology planning; Testing;
         
        
        
        
            Conference_Titel : 
System Sciences, 2007. HICSS 2007. 40th Annual Hawaii International Conference on
         
        
            Conference_Location : 
Waikoloa, HI
         
        
        
            Electronic_ISBN : 
1530-1605
         
        
        
            DOI : 
10.1109/HICSS.2007.599