Title :
Static component interconnect test technology (SCITT) a new technology for assembly testing
Author :
Biewenga, Alex ; Hollmann, Henk D L ; De Jong, Frans ; Lousberg, Maurice
Author_Institution :
Philips Res. Lab., Eindhoven, Netherlands
Abstract :
Modern packaging technology combined with densely populated assemblies requires efficient design for test features. In particular, modern memories with complex interfaces need to be addressed. This paper presents the details of a test technology that makes assembly test more efficient. The method is based on the implementation of XOR and XNOR gates to bypass a functional circuit. It is compatible yet complimentary to boundary-scan. Mathematical proof and simulation results show the effectiveness of this method for detection and diagnosis of assembly faults. Known alternatives are compared for test coverage
Keywords :
design for testability; electronic equipment testing; fault diagnosis; integrated circuit interconnections; integrated circuit testing; logic testing; DFT; SCITT; XNOR gates; XOR; assembly faults; assembly testing; boundary scan test; complex interfaces; simulation; static component interconnect test technology; test coverage; test patterns; Assembly; Binary search trees; Circuit faults; Circuit testing; Electronic equipment testing; Fault diagnosis; History; Integrated circuit interconnections; Manufacturing; Packaging;
Conference_Titel :
Test Conference, 1999. Proceedings. International
Conference_Location :
Atlantic City, NJ
Print_ISBN :
0-7803-5753-1
DOI :
10.1109/TEST.1999.805766
