DocumentCode :
333013
Title :
Load-indentation response of soft tissues with multi-layers
Author :
Zheng, Y.P. ; Mak, A.F.T. ; Qin, L.
Author_Institution :
Rehabilitation Eng. Center, Hong Kong Polytech. Univ., Hong Kong
Volume :
5
fYear :
1998
fDate :
28 Oct-1 Nov 1998
Firstpage :
2270
Abstract :
We described two methods to obtain the load-deformation distribution through the thickness of a human soft tissue layer using a pen-size indentation probe. The probe comprised an ultrasound transducer and a load cell. The internal non-homogeneous deformation was derived from the ultrasound signals reflected from soft tissues. In the first method, cursors were used to track the peaks of ultrasound echo signals reflected from various interfaces. Load-deformation curves of different layers of soft tissues can be obtained accordingly. In the second method, a cross-correlation technique was employed to derive displacement distribution through depth with different indentation load applied. In-vivo experiments conducted at a site over proximal tibia demonstrated that the probe and associated data processing methods were feasible for determination of load-indentation response of multi-layered soft tissues
Keywords :
acoustic correlation; biological tissues; biomechanics; biomedical measurement; biomedical ultrasonics; elasticity; indentation; medical signal processing; biomechanical assessment; cross-correlation technique; displacement distribution; elasticity; human soft tissue layer; in-vivo experiments; internal nonhomogeneous deformation; load cell; load-deformation distribution; load-deformation response; multilayered soft tissues; pen-size indentation probe; proximal tibia; ultrasound echo signal peaks; ultrasound transducer; Biological tissues; Cancer; Capacitive sensors; Elasticity; Humans; Probes; Skin; Ultrasonic imaging; Ultrasonic transducers; Vibrations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location :
Hong Kong
ISSN :
1094-687X
Print_ISBN :
0-7803-5164-9
Type :
conf
DOI :
10.1109/IEMBS.1998.744689
Filename :
744689
Link To Document :
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