Title :
1997 Proceedings Second Annual IEEE International Conference on Innovative Systems in Silicon
Abstract :
The following topics were dealt with: performance analysis; fault tolerance; deep submicron challenges; CAD; micro-electromechanical systems; FPGAs; IC testing; IC interconnects; IC packaging; signal processing; memory systems; architectures; and low-power design
Keywords :
VLSI; circuit CAD; fault tolerant computing; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; integrated memory circuits; logic CAD; logic arrays; micromechanical devices; performance evaluation; signal processing; CAD; FPGAs; IC interconnects; IC packaging; IC testing; architectures; deep submicron challenges; fault tolerance; low-power design; memory systems; micro-electromechanical systems; performance analysis; signal processing;
Conference_Titel :
Innovative Systems in Silicon, 1997. Proceedings., Second Annual IEEE International Conference on
Conference_Location :
Austin, TX, USA
Print_ISBN :
0-7803-4276-3
DOI :
10.1109/ICISS.1997.630238
