Title :
The analysis of measurement methods for high power LED thermal resistance
Author :
Hongmin Wang ; Jing Dong ; Zhili Liu ; BingRu Liang
Author_Institution :
Harbin Univ. of Sci. & Technol., Harbin, China
Abstract :
With the development of high power LED technology, junction temperature as a key factor constrains the performance and the service life of LED, and the main parameter of junction temperature is thermal resistance. Therefore, how to measure the thermal resistance of high power LED quickly and accurately plays an important part in improving the performance and the service life of LED. Based on the study of high power LED thermal resistance and its basic measurement principle, this paper provides an analysis of the different measurement methods for thermal resistance, including of infrared thermal imaging method, spectra method, electrical parameters method, and so on, then compares and analyses their merits and shortcomings, applicable areas and improvement measures that provide the reliable basis for measuring the thermal resistance of high power LED.
Keywords :
infrared imaging; light emitting diodes; thermal resistance; thermal resistance measurement; LED performance improvement; LED service life improvement; electrical parameter method; high power LED thermal resistance measurement method; infrared thermal imaging method; junction temperature; spectra method; Electrical resistance measurement; Junctions; Light emitting diodes; Semiconductor device measurement; Temperature measurement; Temperature sensors; Thermal resistance; high power LED; junction temperature; thermal resistance;
Conference_Titel :
Strategic Technology (IFOST), 2011 6th International Forum on
Conference_Location :
Harbin, Heilongjiang
Print_ISBN :
978-1-4577-0398-0
DOI :
10.1109/IFOST.2011.6021158