• DocumentCode
    3330555
  • Title

    Optimal microheater Patterns with PEDOT:PSS conductors for flexible sensor applications

  • Author

    Ionescu, Clara ; Codreanu, Norocel Dragos ; Svasta, Paul ; Bonfert, Detlef

  • Author_Institution
    Center for Technol. Electron. & Interconnection Tech., Univ. Politeh. of Bucharest, Bucharest, Romania
  • fYear
    2013
  • fDate
    24-27 Oct. 2013
  • Firstpage
    51
  • Lastpage
    56
  • Abstract
    This paper continues the study in the field of microheaters on flexible substrates. The idea of using flexible substrates comes together with the need for low manufacturing costs, having in mind the applications of sensors for home usage and other possible applications as monitors for buildings or basements where possible toxic gases can be accumulated, for instance mathane, carbon monoxide or carbon dioxide. In the current paper we propose the use of poly(3,4-ethylenedioxythiophene) doped with polystyrenesulfonic acid (PEDOT:PSS) as active heating element. The data from literature and our previous experiments have proven that this material can be used as resistive material having the possibility to operate within the desired range of temperatures for sensor applications, between 80 and 100 °C. The test samples with different patterns will be prepared by ink-jetting, with silver ink used as terminations.
  • Keywords
    flexible electronics; microsensors; silver; -jetting; PEDOT:PSS conductors; active heating element; basements; buildings; carbon dioxide; carbon monoxide; flexible sensor applications; flexible substrates; manufacturing costs; mathane; optimal microheater patterns; poly(3,4-ethylenedioxythiophene) doped-polystyrenesulfonic acid; resistive material; silver ink; toxic gas accumulation; Finite element analysis; Heating; Silver; Solid modeling; Substrates; Temperature measurement; Electric Heaters; Flexible sensors; Gas sensors; Microheaters; Thermal Simulation; Thermography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for
  • Conference_Location
    Galati
  • Type

    conf

  • DOI
    10.1109/SIITME.2013.6743643
  • Filename
    6743643