Investigating hole filling in pin-in-paste technology for vapour phase soldering

Author

Batorfi, Reka ; Storcz, Richard ; Ruszinko, Miklos

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2013

fDate

24-27 Oct. 2013

Firstpage

1

Lastpage

6

Abstract

A solution for applying through hole (TH) components in mixed assembly is the pin-in-paste (PIP) technology, when solder paste is deposited onto the plated through holes and the components are placed into the holes through the paste. An important factor in defining the quality of TH soldering is the hole filling, which strongly relies on the capillary force. In our experiments, our aim was to define an optimal paste amount for rectangular and circular pins, for different diameter plated through holes, using two types of SAC solder paste, reflow soldered by vapour phase technology.

Keywords

assembling; copper alloys; reflow soldering; silver alloys; surface mount technology; tin alloys; PIP technology; SAC solder paste; SnAgCu; TH soldering quality; capillary force; circular pins; diameter plated through holes; hole filling; mixed assembly; pin-in-paste technology; plated through holes; rectangular pins; reflow soldering; solder paste; surface mount components; through hole components; vapour phase soldering; Apertures; Filling; Joints; Optical variables measurement; Pins; Printing; Soldering; Pin-in-paste; hole filling; rectangular and circular pins; vapour phase soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology in Electronic Packaging (SIITME), 2013 IEEE 19th International Symposium for

Conference_Location

Galati

Type

conf

DOI

10.1109/SIITME.2013.6743644

Filename

6743644