DocumentCode :
3331028
Title :
Broadband over Powerline field trial for commercial in-building application in a Multi-Dwelling-Unit environment
Author :
Yang, Y.J. ; Arteaga, C.M.
Author_Institution :
Global Technol. Services/IBM, Armonk, NY
fYear :
2009
fDate :
March 29 2009-April 1 2009
Firstpage :
342
Lastpage :
346
Abstract :
This paper presents the results of a twelve month broadband over powerline (BPL) in-building trial in a multi-dwelling unit (MDU) environment utilizing the building´s low voltage electric distribution wiring for the BPL system transport medium to support an IP closed circuit television (CCTV) and VoIP intercom application. Specifically, the BPL infrastructure for this trial was designed to provide high speed bi-directional data communications in support of voice and video security applications for a sixteen story residential building with over one hundred apartments. The BPL system has been extensively monitored during the trial over a five month period with a network management system and has been highly stable, indicating a viable network solution using this technology for broadband applications such as CCTV and Intercom. In contrast to traditional CAT-5E cabling, this system had a much shorter implementation time along with up to 50% cost savings.
Keywords :
Internet telephony; building management systems; carrier transmission on power lines; closed circuit television; data communication; telecommunication network management; IP closed circuit television; VoIP Intercom application; bi-directional data communications; broadband over powerline field trial; commercial in-building application; low voltage electric distribution wiring; multi-dwelling-unit environment; network management system; Bidirectional control; Buildings; Circuits; Communication system security; Data communication; Data security; Low voltage; Power line communications; TV; Wiring; BPL; BPL field trial; CCTV; Intercom system; LV BPL; PLC;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Line Communications and Its Applications, 2009. ISPLC 2009. IEEE International Symposium on
Conference_Location :
Dresden
Print_ISBN :
978-1-4244-3790-0
Electronic_ISBN :
978-1-4244-3792-4
Type :
conf
DOI :
10.1109/ISPLC.2009.4913454
Filename :
4913454
Link To Document :
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