DocumentCode
3331566
Title
A novel electrostatic vertical comb actuator fabricated on [111] silicon wafer
Author
Chu, Chien Cheng ; Tsai, Julius U. ; Hsieh, Jerwei ; Fang, Weileun
Author_Institution
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2003
fDate
19-23 Jan. 2003
Firstpage
56
Lastpage
59
Abstract
In this study, a novel electrostatic vertical comb actuator (VCA) is designed and fabricated on a [111] silicon substrate. The BELST process was exploited to fabricate the proposed VCA. Three advantages for this VCA can be observed. Firstly, through some exquisite design the fabrication process has no critical alignment and bonding problems. Secondly, the relative vertical position between the moving and the stationary finger can be adjusted freely to optimize the performance of the VCA. Thirdly, both the large mirror structure and trimmed torsional spring are available through this process. Thus improved performance regarding enlarged traveling distance with reduced driving voltage can be obtained. According to the static test, this VCA can achieve optical scanning angle near 5 degree when driven at 90 V Moreover in the dynamic test, this actuator can deliver a significant output when driven near 4.1 kHz.
Keywords
electrostatic actuators; silicon; 4.1 kHz; 90 V; BELST process; Si; VCA; electrostatic vertical comb actuator; mirror structure; trimmed torsional spring; Bonding; Electrostatic actuators; Fabrication; Fingers; Mirrors; Process design; Silicon; Springs; Testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-7744-3
Type
conf
DOI
10.1109/MEMSYS.2003.1189686
Filename
1189686
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