DocumentCode
3331592
Title
A novel design technique for soft error hardening of Nanoscale CMOS memory
Author
Lin, Sheng ; Kim, Yong-Bin ; Lombardi, Fabrizio
Author_Institution
Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
fYear
2009
fDate
2-5 Aug. 2009
Firstpage
679
Lastpage
682
Abstract
Tolerance to soft errors has become a strict requirement in today´s nanoscale CMOS designs. This paper proposes a new hardening design technique for CMOS memory cell at 32nm feature size. The proposed hardened memory cell overcomes the problems associated with the previous designs by utilizing novel access and refreshing mechanisms. Simulation shows that the data stored in the proposed hardened memory cell does not change even for a transient pulse with more than two times higher charge than the conventional memory cell and achieves a 55% reduction in power delay product compared to the DICE cell, thus achieving a significant improvement in soft error tolerance. The extensive HSPICE simulations show that the proposed memory cell is preferable over existing configurations when designing hardened memories for both high performance and soft error tolerance.
Keywords
CMOS memory circuits; integrated circuit design; nanoelectronics; radiation hardening (electronics); HSPICE simulation; data storage; nanoscale CMOS memory design; power delay product; size 32 nm; soft error hardening; CMOS memory circuits; CMOS technology; Capacitance; Circuit simulation; Circuit synthesis; Computer errors; Delay; Latches; Nanotechnology; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2009. MWSCAS '09. 52nd IEEE International Midwest Symposium on
Conference_Location
Cancun
ISSN
1548-3746
Print_ISBN
978-1-4244-4479-3
Electronic_ISBN
1548-3746
Type
conf
DOI
10.1109/MWSCAS.2009.5236005
Filename
5236005
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