• DocumentCode
    3331592
  • Title

    A novel design technique for soft error hardening of Nanoscale CMOS memory

  • Author

    Lin, Sheng ; Kim, Yong-Bin ; Lombardi, Fabrizio

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
  • fYear
    2009
  • fDate
    2-5 Aug. 2009
  • Firstpage
    679
  • Lastpage
    682
  • Abstract
    Tolerance to soft errors has become a strict requirement in today´s nanoscale CMOS designs. This paper proposes a new hardening design technique for CMOS memory cell at 32nm feature size. The proposed hardened memory cell overcomes the problems associated with the previous designs by utilizing novel access and refreshing mechanisms. Simulation shows that the data stored in the proposed hardened memory cell does not change even for a transient pulse with more than two times higher charge than the conventional memory cell and achieves a 55% reduction in power delay product compared to the DICE cell, thus achieving a significant improvement in soft error tolerance. The extensive HSPICE simulations show that the proposed memory cell is preferable over existing configurations when designing hardened memories for both high performance and soft error tolerance.
  • Keywords
    CMOS memory circuits; integrated circuit design; nanoelectronics; radiation hardening (electronics); HSPICE simulation; data storage; nanoscale CMOS memory design; power delay product; size 32 nm; soft error hardening; CMOS memory circuits; CMOS technology; Capacitance; Circuit simulation; Circuit synthesis; Computer errors; Delay; Latches; Nanotechnology; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. MWSCAS '09. 52nd IEEE International Midwest Symposium on
  • Conference_Location
    Cancun
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4244-4479-3
  • Electronic_ISBN
    1548-3746
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2009.5236005
  • Filename
    5236005