DocumentCode
3331619
Title
SRT interconnection network on 3D stacked implementation by considering thermo-radiation
Author
Inoguchi, Yasushi ; Matsuzawa, Teruo ; Horiguchi, Susumu
Author_Institution
Center for Inf. Sci., Japan Adv. Inst. of Sci. & Technol., Ishikawa, Japan
fYear
1997
fDate
8-10 Oct 1997
Firstpage
41
Lastpage
51
Abstract
This paper addresses the reconfiguration of Shifted Recursive Torus (SRT) network by considering thermo-radiation in stacked wafers implementation. The SRT networks are hierarchical torus networks and suitable for massively parallel systems. We propose fault-tolerance schemes for SRT networks to keep high network performance in stacked wafers implementation. The cooling of stacked wafers, however, is one of the most crucial problems for implementation of massively parallel systems. Two cooling approaches have been proposed for SRT in stacked implementation. Introducing a thermo-radiation model into SRT in stacked implementation, reconfiguration performance of SRT was evaluated. Comparing the system yields and the maximum temperatures, these cooling approaches can keep high system yield and lower temperature of 3D implementation
Keywords
cooling; fault tolerant computing; multiprocessor interconnection networks; reconfigurable architectures; wafer-scale integration; 3D stacked implementation; SRT interconnection network; cooling; fault-tolerance scheme; hierarchical torus networks; massively parallel systems; reconfiguration performance; shifted recursive torus; system yields; thermo-radiation model; Concurrent computing; Cooling; Fault tolerant systems; Information science; Multiprocessing systems; Multiprocessor interconnection networks; Numerical simulation; Silicon; Temperature; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Innovative Systems in Silicon, 1997. Proceedings., Second Annual IEEE International Conference on
Conference_Location
Austin, TX
ISSN
1094-7116
Print_ISBN
0-7803-4276-3
Type
conf
DOI
10.1109/ICISS.1997.630245
Filename
630245
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