• DocumentCode
    3331619
  • Title

    SRT interconnection network on 3D stacked implementation by considering thermo-radiation

  • Author

    Inoguchi, Yasushi ; Matsuzawa, Teruo ; Horiguchi, Susumu

  • Author_Institution
    Center for Inf. Sci., Japan Adv. Inst. of Sci. & Technol., Ishikawa, Japan
  • fYear
    1997
  • fDate
    8-10 Oct 1997
  • Firstpage
    41
  • Lastpage
    51
  • Abstract
    This paper addresses the reconfiguration of Shifted Recursive Torus (SRT) network by considering thermo-radiation in stacked wafers implementation. The SRT networks are hierarchical torus networks and suitable for massively parallel systems. We propose fault-tolerance schemes for SRT networks to keep high network performance in stacked wafers implementation. The cooling of stacked wafers, however, is one of the most crucial problems for implementation of massively parallel systems. Two cooling approaches have been proposed for SRT in stacked implementation. Introducing a thermo-radiation model into SRT in stacked implementation, reconfiguration performance of SRT was evaluated. Comparing the system yields and the maximum temperatures, these cooling approaches can keep high system yield and lower temperature of 3D implementation
  • Keywords
    cooling; fault tolerant computing; multiprocessor interconnection networks; reconfigurable architectures; wafer-scale integration; 3D stacked implementation; SRT interconnection network; cooling; fault-tolerance scheme; hierarchical torus networks; massively parallel systems; reconfiguration performance; shifted recursive torus; system yields; thermo-radiation model; Concurrent computing; Cooling; Fault tolerant systems; Information science; Multiprocessing systems; Multiprocessor interconnection networks; Numerical simulation; Silicon; Temperature; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Innovative Systems in Silicon, 1997. Proceedings., Second Annual IEEE International Conference on
  • Conference_Location
    Austin, TX
  • ISSN
    1094-7116
  • Print_ISBN
    0-7803-4276-3
  • Type

    conf

  • DOI
    10.1109/ICISS.1997.630245
  • Filename
    630245