Fabrication of a microvalve with piezoelectric actuation

Author

Li, Hu Quan ; Steyn, Jasper L. ; Turner, K.T. ; Yaglioglu, Onnik

Author_Institution

Massachusetts Inst. of Technol., Cambridge, MA, USA

fYear

2003

fDate

19-23 Jan. 2003

Firstpage

92

Lastpage

95

Abstract

The fabrication of an active MEMS micro valve driven by integrated bulk single crystal piezoelectric actuators is reported. The valve is a nine-layer structure of glass, Si, and silicon on insulator (SOI) assembled by wafer level fusion bonding and anodic bonding, die level anodic bonding and eutectic bonding. Valve head strokes as large as 20μm were realized through hydraulic amplification of small strokes of piezoelectric actuators. A flow rate of 0.21ml/s was obtained at 1 kHz. The fabrication, bonding and assembly processes, as well as some test results are described.

Keywords

microvalves; piezoelectric actuators; silicon-on-insulator; wafer bonding; 1 kHz; SOI; Si-SiO₂; active MEMS microvalve; anodic bonding; die level anodic bonding; eutectic bonding; fabrication; microvalve; piezoelectric actuation; piezoelectric actuators; wafer level fusion bonding; Assembly; Fabrication; Glass; Micromechanical devices; Microvalves; Piezoelectric actuators; Silicon on insulator technology; Testing; Valves; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on

ISSN

1084-6999

Print_ISBN

0-7803-7744-3

Type

conf

DOI

10.1109/MEMSYS.2003.1189695

Filename

1189695