DocumentCode
3331963
Title
Static Component Interconnection Test Technology (SCITT)
Author
Hellmold, Steffen
Author_Institution
Fujitsu Microelectronics, Inc.
fYear
1999
fDate
1999
Firstpage
1140
Lastpage
1140
Keywords
Assembly; Chip scale packaging; Circuit faults; Circuit testing; Costs; Fault diagnosis; Integrated circuit interconnections; Logic testing; Microelectronics; Pins;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1999. Proceedings. International
ISSN
1089-3539
Print_ISBN
0-7803-5753-1
Type
conf
DOI
10.1109/TEST.1999.805872
Filename
805872
Link To Document