• DocumentCode
    3332636
  • Title

    A novel protein micro stamper with back-filling reservoir for simultaneous immobilization of large protein arrays

  • Author

    Lin, Shih-Chang ; Ho, Cheng-En ; Tseng, Fan-Gang ; Tsai, Yi-Chin ; Huang, Haimei ; Chieng, Ching-Chang

  • Author_Institution
    Eng. & Syst. Sci. Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2003
  • fDate
    19-23 Jan. 2003
  • Firstpage
    299
  • Lastpage
    302
  • Abstract
    This paper proposes a novel stamping system using a back-filling micro-stamp chip with discrete dispensing channels to produce precise and uniform protein microarrays for disease diagnosis or drug screening. Unlike the micro arrayer spotting biosamples in serial, this novel device can simultaneously spot hundreds to thousands of bioreagents into a dense array in one minute. Reservoir filling, solution transportation, micro/nano imprinting, and droplet break-down processes of the micro stamp system employ only surface tension passively by the channel design of the device, thus no actuation means or external energy sources were required to manipulate bioreagents. Both simulation and experiment showed the capability of this system to accurately transfer proteins onto uniform arrays. Experimental results also verified that the spot size and intensity variations of spotted protein arrays were less than 5% across the whole chip with 144 protein spots.
  • Keywords
    biotechnology; chemical analysis; microfluidics; proteins; back-filling reservoir; discrete dispensing channels; disease diagnosis; droplet break-down processes; drug screening; intensity variations; large protein arrays; micro/nano imprinting; protein micro stamper; reservoir filling; simultaneous immobilization; solution transportation; spot size; surface tension; Bovine; Diseases; Drugs; Filling; Microchannel; Protein engineering; Reservoirs; Surface tension; Systems engineering and theory; Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-7744-3
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2003.1189745
  • Filename
    1189745