Title :
High frequency characteristics of modular metric, high-density connector systems
Author :
Wallenhorst, U. ; Brenner, Andreas
Author_Institution :
HARTING Elektronik GmbH, Espelkamp
Abstract :
A signal integrity analysis of modular metric high-density connector systems for use in telecommunication, computer- and other high-speed applications is presented. Carefully designed appropriate high performance test-setups-with different contact-pitch-consisting of backplane and daughtercard are the basis for all time- and frequency-domain measurements like TDR/TDT, crosstalk, insertion loss, VSWR, propagation delay etc. Based on 2-D FEM-calculations high-accurate simulation-models are produced which include multiline-crosstalk. The calculated curves are in an excellent agreement with the measured data. The behaviour in “bus-like” applications (connectors as a part of a stub) is discussed
Keywords :
crosstalk; electric connectors; electromagnetic compatibility; finite element analysis; high-frequency transmission line measurement; modules; transmission line theory; 2D FEM; EMC; TDR/TDT; VSWR; backplane; bus-like applications; computer applications; contact pitch; crosstalk; daughtercard; frequency-domain measurement; high frequency characteristics; high performance test setups; high-density connector systems; high-speed applications; insertion loss; modular metric connector systems; multiline crosstalk; propagation delay; signal integrity analysis; simulation models; telecommunication; time-domain measurement; Application software; Backplanes; Connectors; Contacts; Frequency domain analysis; Frequency measurement; Performance loss; Signal analysis; Telecommunication computing; Testing;
Conference_Titel :
Electromagnetic Compatibility, 1995. Symposium Record., 1995 IEEE International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3608-9
DOI :
10.1109/ISEMC.1995.523606
