DocumentCode
3332916
Title
Micromachined biodegradable microstructures
Author
Park, JunE-Hwan ; Davis, Shawn ; Yoon, Yong-Kyu ; Prausnitz, Mark R. ; Allen, Mark G.
Author_Institution
Sch. of Biomed., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2003
fDate
19-23 Jan. 2003
Firstpage
371
Lastpage
374
Abstract
We present a fabrication approach for the production of micromachined biodegradable microstructures, and illustrate its application in two areas: biodegradable microneedles for transdermal drug delivery, and biodegradable ratcheting surgical ties for blood vessel surgery. We fabricated solid polymer microneedles out of polyglycolide, polylactide and their copolymer using a micromolding technique that created needles with beveled tips. Polymer microneedles were strong enough to be inserted into cadaver skin without breaking. Polymer microneedles impregnated with both low- and high- molecular weight model compounds to simulate drug release were fabricated and inserted into full thickness cadaver skin. Quantitative measurement of model compound release as a function of time was obtained. The fabrication technology was also utilized to produce more mechanically complex biodegradable microstructures: cable ties for surgical ratcheting. These devices were successfully integrated with blood vessel tissue. The change in the mechanical properties of these devices under physiological conditions was investigated and shown to depend on the chemical and physical properties of polymer, implant temperature, and chemical environment.
Keywords
blood vessels; drug delivery systems; micromachining; moulding; polymer blends; polymers; biodegradable microneedles; biodegradable ratcheting surgical ties; blood vessel surgery; cadaver skin; copolymers; drug release; micromachined biodegradable microstructures; micromolding; polyglycolide; polylactide; solid polymer microneedles; transdermal drug delivery; Biodegradable materials; Blood vessels; Cadaver; Chemicals; Fabrication; Mechanical factors; Microstructure; Polymers; Skin; Surgery;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-7744-3
Type
conf
DOI
10.1109/MEMSYS.2003.1189763
Filename
1189763
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