DocumentCode :
333315
Title :
Detection of somatropin and corticosterone with imaging ellipsometry
Author :
Zhao, Zi-Yan ; Jin, Gang ; Wang, Zhan-Hui
Author_Institution :
Inst. of Mater. Med., Shandong Acad. of Med. Sci., Jinan, China
Volume :
2
fYear :
1998
fDate :
29 Oct-1 Nov 1998
Firstpage :
590
Abstract :
Imaging ellipsometry has been recently developed to visualize the lateral thickness distribution of biomolecular layers with a high sensitivity for a thickness variation, i.e., the visualization of molecular interaction on biolayer with a measurement of thickness variation. By using this technique, we have made the detection of protein hormone, human somatropin (HGH) and steroid hormone, corticosterone: BSA. In the study, silicon wafers were used as substrates on which the anti-HGH or anti-corticosterone was adsorbed to make a biochip, and then the biochip was incubated in solutions containing HGH or corticosterone: BSA for molecular interaction. Thus, the hormones could be detected by the thickness increase, which caused by the specific affinity between hormones and their anti-bodies. In present study we can detect HGH in concentrations of 0.08, 0.008 and 0.004 IU/ml and corticosterone:BSA in concentrations even till 0.5 μg/ml and 0.05 μg/ml
Keywords :
CCD image sensors; adsorption; bio-optics; biochemistry; biomedical imaging; biosensors; ellipsometry; proteins; thickness measurement; CCD imaging; adsorption; anti-corticosterone; anti-human somatropin; biochip; biomolecular layers; biosensor concept; corticosterone detection; endocrine hormones; high sensitivity; imaging ellipsometry; incubated in solutions; lateral thickness distribution; protein hormone; somatropin detection; specific affinity; steroid hormone; video signal; Biochemistry; Biomedical imaging; Ellipsometry; Ethanol; Optical buffering; Optical imaging; Optical surface waves; Proteins; Thickness measurement; Visualization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location :
Hong Kong
ISSN :
1094-687X
Print_ISBN :
0-7803-5164-9
Type :
conf
DOI :
10.1109/IEMBS.1998.745466
Filename :
745466
Link To Document :
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