Title :
Three-dimensional integration technology for real time micro-vision system
Author :
Kurino, H. ; Matsumoto, T. ; Yu, K.-H. ; Miyakawa, N. ; Itani, H. ; Tsukamoto, H. ; Koyanagi, M.
Author_Institution :
Dept. of Machine Intelligence & Syst. Eng., Tohoku Univ., Sendai, Japan
Abstract :
It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed
Keywords :
computer vision; integrated circuit technology; integrated optoelectronics; large scale integration; parallel processing; real-time systems; LSI; buried interconnection; image processing; micro-bump; parallel processing; real time micro-vision system; three-dimensional integration technology; wafer alignment; wafer bonding; wafer thinning; Image converters; Image processing; Integrated circuit interconnections; Large scale integration; Latches; Parallel processing; Pipelines; Real time systems; Sensor arrays; Wafer bonding;
Conference_Titel :
Innovative Systems in Silicon, 1997. Proceedings., Second Annual IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4276-3
DOI :
10.1109/ICISS.1997.630262
