DocumentCode
3333460
Title
Sub-micron thick high sensitive piezoresistive cantilevers by boron etch stop and argon implantation
Author
Gel, Murat ; Shimoyama, Isao
Author_Institution
Shimoyama Lab., Univ. of Tokyo, Japan
fYear
2003
fDate
19-23 Jan. 2003
Firstpage
494
Lastpage
497
Abstract
A new method far improving piezoresistive response of thin (<1 μm) cantilevers with Argon implantation is described. Argon implantation is used to damage atomic structure of one side of the cantilever. Test cantilevers have thickness of less than 500 nm while length and width is 60 μm and 30 μm respectively. For a total implanted dose of 35 × 1015 ions/cm2 maximum displacement sensitivity obtained is 8.24 × 10-7 [1/Å] which is 82% of the theoretical maximum. Force sensitivity is found to be 3.5 × 10-3 [1/μN].
Keywords
argon; boron; displacement measurement; force measurement; ion implantation; microsensors; piezoelectric actuators; sputter etching; 1 micron; 30 micron; 500 nm; 60 micron; Ar implantation; B etch stop; maximum displacement sensitivity; sub-micron thick high sensitive piezoresistive cantilevers; total implanted dose; Amorphous materials; Argon; Boron; Conductivity; Etching; Fabrication; Force measurement; Piezoresistance; Silicon; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-7744-3
Type
conf
DOI
10.1109/MEMSYS.2003.1189794
Filename
1189794
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