DocumentCode :
3333502
Title :
Fabrication of a CMOS compatible pressure sensor for harsh environments
Author :
Pakula, L.S. ; Yang, H. ; Pham, H.T.M. ; French, P.J. ; Sarro, P.M.
Author_Institution :
DIMES-EI, Delft Univ. of Technol., Netherlands
fYear :
2003
fDate :
19-23 Jan. 2003
Firstpage :
502
Lastpage :
505
Abstract :
This paper presents the fabrication and characteristics of CMOS compatible absolute pressure sensors for harsh environments. The sensor consist of 100 circle membranes with total capacity of 14 pF. Surface micromachining techniques were involved in fabrication of the sensor. Due to its good properties PECVD SiC, layers are used as mechanical layers. The stiction problems were avoided due to use of polyimide PI2610 as sacrificial layer. The pressure sensors were fabricated with change of capacitance of 3.4pF in full pressure range.
Keywords :
micromachining; microsensors; plasma CVD coatings; pressure sensors; silicon compounds; stiction; 14 pF; 3.4 pF; CMOS compatible pressure sensor; SiC; characteristics; circle membranes; fabrication; harsh environments; polyimide P12610 sacrificial layer; stiction problems; surface micromachining techniques; total capacity; Biomembranes; Capacitance; Capacitive sensors; Fabrication; Mechanical factors; Mechanical sensors; Micromachining; Polyimides; Sensor phenomena and characterization; Silicon carbide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN :
1084-6999
Print_ISBN :
0-7803-7744-3
Type :
conf
DOI :
10.1109/MEMSYS.2003.1189796
Filename :
1189796
Link To Document :
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