DocumentCode :
3333519
Title :
A doubly anchored surface micromachined Pirani gauge for vacuum package characterization
Author :
Stark, Brian H. ; Mei, Yuhai ; Zhang, Chunbo ; Najafi, Khalil
Author_Institution :
Center for Wireless Integrated Microsystems, Michigan Univ., Ann Arbor, MI, USA
fYear :
2003
fDate :
19-23 Jan. 2003
Firstpage :
506
Lastpage :
509
Abstract :
This paper presents a surface micromachined Pirani gauge for measuring vacuum pressure inside sealed micro cavities. This thin gap (800nm) SiO2/Si3N4/SiO2 gauge can measure absolute pressure from atmospheric to less than 1mTorr without sophisticated interface electronics by using a reliable software calibration technique. This allows the sensor to be integrated with common vacuum packaging technologies to measure leak rates as low as 10-17cm3/s. This represents a 5 order of magnitude improvement over traditional helium leak testing with a substantially reduced cost.
Keywords :
micromachining; microsensors; pressure measurement; pressure sensors; silicon compounds; 1 atm to 1 mtorr; 800 nm; SiO2/Si3N4/SiO2 gauge; absolute pressure measurement; doubly anchored surface micromachined Pirani gauge; leak rates; reliable software calibration technique; vacuum package characterization; Atmospheric measurements; Biomembranes; Dielectric substrates; Helium; Packaging machines; Pressure measurement; Sensor phenomena and characterization; Testing; Thermal conductivity; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN :
1084-6999
Print_ISBN :
0-7803-7744-3
Type :
conf
DOI :
10.1109/MEMSYS.2003.1189797
Filename :
1189797
Link To Document :
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