DocumentCode
3333921
Title
Surface-micromachined flexible polysilicon sensor array
Author
Hwang, Eun-Soo ; Kim, Yong-Jun ; Ju, Byeong-Kwon
Author_Institution
Dept. of Mech. Eng., Yonsei Univ., Seoul, South Korea
fYear
2003
fDate
19-23 Jan. 2003
Firstpage
582
Lastpage
585
Abstract
A flexible polysilicon strain gauge array has been realized using surface micromachining with SiO2 sacrificial layer. The realized sensor array is mechanically flexible, which can be attached on nonplanar surfaces. To realize the flexible strain gauge, a new packaging scheme using polysilicon/oxide based surface-micromachining was developed. The proposed packaging scheme completes the strain sensors and the circuit board on a single process, which eliminates additional assembly and alignment problems. The measured gauge factor shows that it is more sensitive than metal strain gauge. Unlike a single-crystal silicon strain gauge, the proposed polysilicon gauge does not have any limitations in the direction of strain.
Keywords
elemental semiconductors; micromachining; packaging; piezoelectric semiconductors; silicon; strain gauges; Si; Si-SiO2; flexible polysilicon strain gauge array; packaging; strain sensors; surface micromachining; surface-micromachined flexible polysilicon sensor array; Capacitive sensors; Fabrication; Mechanical sensors; Micromachining; Packaging; Piezoresistance; Polyimides; Semiconductor films; Sensor arrays; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-7744-3
Type
conf
DOI
10.1109/MEMSYS.2003.1189816
Filename
1189816
Link To Document