• DocumentCode
    3333921
  • Title

    Surface-micromachined flexible polysilicon sensor array

  • Author

    Hwang, Eun-Soo ; Kim, Yong-Jun ; Ju, Byeong-Kwon

  • Author_Institution
    Dept. of Mech. Eng., Yonsei Univ., Seoul, South Korea
  • fYear
    2003
  • fDate
    19-23 Jan. 2003
  • Firstpage
    582
  • Lastpage
    585
  • Abstract
    A flexible polysilicon strain gauge array has been realized using surface micromachining with SiO2 sacrificial layer. The realized sensor array is mechanically flexible, which can be attached on nonplanar surfaces. To realize the flexible strain gauge, a new packaging scheme using polysilicon/oxide based surface-micromachining was developed. The proposed packaging scheme completes the strain sensors and the circuit board on a single process, which eliminates additional assembly and alignment problems. The measured gauge factor shows that it is more sensitive than metal strain gauge. Unlike a single-crystal silicon strain gauge, the proposed polysilicon gauge does not have any limitations in the direction of strain.
  • Keywords
    elemental semiconductors; micromachining; packaging; piezoelectric semiconductors; silicon; strain gauges; Si; Si-SiO2; flexible polysilicon strain gauge array; packaging; strain sensors; surface micromachining; surface-micromachined flexible polysilicon sensor array; Capacitive sensors; Fabrication; Mechanical sensors; Micromachining; Packaging; Piezoresistance; Polyimides; Semiconductor films; Sensor arrays; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-7744-3
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2003.1189816
  • Filename
    1189816