Title : 
60GHz ASK LTCC SoP transmitter design
         
        
            Author : 
Jaafar, Salizul ; Amiruddin, Mohd Fadzil ; Bujang, Suhandi ; Ariffin, Azzemi ; Sulaiman, Azlan
         
        
            Author_Institution : 
Syst. Technol. Program, Telekom Malaysia R&D Sdn. Bhd., Cyberjaya, Malaysia
         
        
        
        
        
        
            Abstract : 
A highly integrated 60GHz-band ASK transmitter, the so-called system-on-package (SoP) module, which employs a multi-layer structure has been developed and fabricated. This small size, high performance and lightweight transmitter module is intended for used in V-band wireless applications such as high-speed multimedia data communication. The transmitter was designed based on a direct conversion architecture with ASK modulation scheme. This design technique offers a few advantages such as a simple architecture, low cost and feasible to transmit data at a speed of over 1 Gb/s. For low-attenuation characteristics and resonance suppression of the SoP, the coplanar double wire-bond transition, CPW-to-stripline transition, e-Microstripline, as well as planar and vertical via transitions has been applied. In this work, the transmitter system-on-package (SoP) has been monolithically implemented with a six-layer LTCC block integrating a power amplifier, modulator and two frequency multipliers on the block. The fabricated transmitter SoP with size of 13.82mm × 6.55mm achieves an output of 13dBm at a RF frequency of 58.78 GHz.
         
        
            Keywords : 
amplitude shift keying; ceramic packaging; coplanar waveguides; frequency multipliers; microstrip lines; millimetre wave power amplifiers; radio transmitters; strip line transitions; system-on-package; ASK LTCC SoP transmitter design; ASK modulation scheme; CPW-to-stripline transition; V-band wireless applications; bit rate 1 Gbit/s; coplanar double wire-bond transition; direct-conversion architecture; e-microstripline; frequency 58.78 GHz; frequency 60 GHz; frequency multipliers; high-speed multimedia data communication; low-attenuation characteristics; modulator; multilayer structure; power amplifier; resonance suppression; six-layer LTCC block; system-on-package module; transmitter module; vertical via transitions; Amplitude shift keying; Coplanar waveguides; MMICs; Power amplifiers; Radio transmitters; Wireless communication;
         
        
        
        
            Conference_Titel : 
Communications (APCC), 2011 17th Asia-Pacific Conference on
         
        
            Conference_Location : 
Sabah
         
        
            Print_ISBN : 
978-1-4577-0389-8
         
        
        
            DOI : 
10.1109/APCC.2011.6152910