DocumentCode
3334293
Title
Mechanical properties of compressively prestressed thin films extracted from pressure dependent ripple profiles of long membranes
Author
Kramer, Torsten ; Paul, Oliver
Author_Institution
Inst. for Microsystem Technol., Freiburg Univ., Germany
fYear
2003
fDate
19-23 Jan. 2003
Firstpage
678
Lastpage
681
Abstract
We report the determination of mechanical properties of compressively prestressed thin films from the postbuckling behavior of long rectangular membranes under differential pressure. Such structures show buckling profiles with ripples of pressure-dependent wavelength λ and amplitude Δw. At sufficiently high loads they undergo a symmetry transition to a ripple-free deflection profile. A model based on the energy minimization method (EMM) was developed to describe the mechanical behavior of these compressively prestressed membranes. For this purpose a new set of trial functions was constructed enabling the complex behavior including the symmetry transition to be described. Values for Young´s modulus E and the prestrain ε0 can be extracted from the comparison of experimental load-deflection data and EMM simulations. The model was applied to ripple data of a PECVD silicon nitride. Young´s modulus and the prestrain were found to be E=160 GPa and ε0=-7.0×10-4 respectively.
Keywords
Young´s modulus; buckling; insulating thin films; micromechanical devices; silicon compounds; tensile strength; PECVD Si3N4; Si3N4; Young´s modulus; compressively prestressed thin films; energy minimization method; long membranes; mechanical properties; postbuckling behavior; pressure dependent ripple profiles; ripple-free deflection profile; symmetry transition; trial functions; Biomembranes; Etching; Frequency; Laboratories; Mechanical factors; Micromechanical devices; Minimization methods; Silicon compounds; Stress; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-7744-3
Type
conf
DOI
10.1109/MEMSYS.2003.1189840
Filename
1189840
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