Title :
System-in-a-package technology for 3D integration of radar modules
Author :
Brebels, S. ; Sun, X. ; Carchon, G. ; Posada, G. ; Dussopt, L. ; Dubois, M.A. ; Vandenbosch, G. ; De Raedt, W.
Author_Institution :
HRFP Group, IMEC, Leuven
Abstract :
3D thin-film technology including substrate vias and integrated passives is used as a platform for heterogeneous integration of high frequency wireless systems and radar. The features of the technology are first described and next demonstrated with an integrated Doppler radar operating in the Ku band.
Keywords :
Doppler radar; microwave integrated circuits; system-in-package; 3D thin-film technology; Ku band operation; high frequency wireless system integration; integrated Doppler radar; system-in-a-package technology; Doppler radar; Glass; Integrated circuit interconnections; Integrated circuit technology; Packaging; Passive radar; Radio frequency; Substrates; Thin film circuits; Transistors;
Conference_Titel :
Microwaves, Radar and Remote Sensing Symposium, 2008. MRRS 2008
Conference_Location :
Kiev
Print_ISBN :
978-1-4244-2688-1
Electronic_ISBN :
978-1-4244-2689-8
DOI :
10.1109/MRRS.2008.4669558
