DocumentCode
333514
Title
Contraction augmentation in left ventricular nonischemic region during ischemia
Author
Wang, Jia-Jung ; Pan, Richard L -C ; Li, John K -J ; Drzewiecki, Gary
Author_Institution
Dept. of Biomed. Eng., Yuanpei Inst. of Med. Technol., Taiwan
fYear
1998
fDate
29 Oct-1 Nov 1998
Firstpage
411
Abstract
We display the contraction augmentation phenomenon in left ventricular (LV) nonischemic wall during ischemia, with a simplified cardiovascular system model. The model is composed of a two-zone left ventricle, a preload equivalent and an afterload equivalent. Geometry of the LV shape was assumed to be truncated-spherical and the ischemic zone size was allowed to be altered. The model predicts that during ischemia the systolic shortening (SS) in the nonischemic region will increase from 12.04 (control) to 19.33%, but for the ischemic region SS will decrease from control to -1.81%. In addition, the isovolumic shortening (IS) and ejection shortening (ES) are all increased in the nonischemic region when compared to the preischemic condition. Based on the modeling results, it is concluded that augmentation during ischemia can in part be explained by the shifting of the blood volume from the nonischemic to ischemic zone, which is resulted from the diminished contractile force in ischemic muscle
Keywords
cardiovascular system; haemodynamics; muscle; physiological models; afterload equivalent; blood volume shift; computer model; contraction augmentation; diminished contractile force; ejection shortening; haemodynamic variables; ischemia; ischemic muscle; ischemic zone size; isovolumic shortening; left ventricular nonischemic region; preload equivalent; simplified cardiovascular system model; systolic shortening; truncated-spherical shape; two-zone left ventricle; Biomedical engineering; Blood; Cardiology; Cardiovascular system; Electronic mail; Equations; Filling; Ischemic pain; Shape; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location
Hong Kong
ISSN
1094-687X
Print_ISBN
0-7803-5164-9
Type
conf
DOI
10.1109/IEMBS.1998.745931
Filename
745931
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