Title :
An integrated instrumentation approach to the study of wound healing
Author :
Wertheim, David ; Melhuish, John ; Llewellyn, Mair ; Hoppe, Andreas ; Williams, Robert ; Harding, Keith
Author_Institution :
Dept. of Electron., Glamorgan Univ., Pontypridd, UK
fDate :
29 Oct-1 Nov 1998
Abstract :
The authors have developed a system for monitoring pressure and skin temperature associated with compression therapy. The system was applied to investigate forces and skin surface temperature under the 4 layer bandage system in 5 healthy volunteers. At a position about 8 cm above the medial malleolus the authors observed a median pressure of 32 mmHg (range 27 to 40 mmHg), in the sitting position, and 40 mmHg (range 25 to 47 mmHg) in the standing position. Twelve minutes after bandage application there was an increase in temperature on the bandaged legs, median=+1.9°C (range+1.5 to +4.3 °C) and a decrease on the unbandaged legs, median=-0.7°C (range -0.2 to 1.4°C). The range in applied pressure and the variation observed with posture suggests that the mode of action of compression therapy may not be solely the result of the degree of compression applied. The increase in skin surface temperature may suggest a temperature related increase in skin blood flow. This study illustrates the advantage of combining results of the different investigations of pressure and skin surface temperature
Keywords :
biomechanics; biomedical equipment; biothermics; patient monitoring; patient treatment; pressure measurement; skin; temperature measurement; 25 to 47 mmHg; 4 layer bandage system; 8 cm; compression therapy; healthy volunteers; integrated instrumentation approach; medical instrumentation; pressure monitoring; sitting position; skin blood flow; skin temperature; unbandaged legs; wound healing study; Force measurement; Instruments; Leg; Medical treatment; Monitoring; Sensor systems; Skin; Surface treatment; Temperature sensors; Wounds;
Conference_Titel :
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-5164-9
DOI :
10.1109/IEMBS.1998.746926