DocumentCode
333616
Title
Biochemical sensors based on thin-film waveguide
Author
Minamitani, Haruyuki ; Kim, Kyungho ; Matsumoto, Kunihiro
Author_Institution
Fac. of Sci. & Technol., Keio Univ., Kanagawa, Japan
Volume
4
fYear
1998
fDate
29 Oct-1 Nov 1998
Firstpage
1855
Abstract
Biochemical sensors based on thin-film waveguide are proposed which can measure the concentration of sample solutions. In order to investigate the applicability of these sensors to Ca2+ and glucose measurement, the waveguide was fabricated with 3 layers: the substrate (pyrex glass), the waveguide layer (sputtered with Corning 7059 glass) and sample layer having PVC sensing membrane and/or sample chamber. We applied the sensor to sample a solution whose CaCl2 concentration was gradually altered. Also, we applied it to red colored glucose solutions. In this experiment, we found that the thin-film waveguide sensor possessed high sensitivity at 488 nm of argon laser. In addition, our glucose sensor could measure a wide range of glucose concentrations from 0 mg/dl to 750 mg/dl and Ca2+ could be measured from 10-5 mol to 10-0 mol. The sensitivity of this waveguide sensor is increased by the interaction length which means the reaction area between the evanescent field of propagated light and the sample layer. These findings suggested that the proposed waveguide biochemical sensors are applicable to various samples
Keywords
biochemistry; biosensors; chemical sensors; integrated optics; optical films; optical sensors; optical waveguides; 488 nm; Ca; Ca2+ measurement; Corning 7059 glass; PVC sensing membrane; biochemical sensors; evanescent field; glucose measurement; high sensitivity; pyrex glass; red colored glucose solutions; thin-film waveguide; three-layer slab waveguide; Argon; Biomembranes; Biosensors; Glass; Optical propagation; Sputtering; Substrates; Sugar; Thin film sensors; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location
Hong Kong
ISSN
1094-687X
Print_ISBN
0-7803-5164-9
Type
conf
DOI
10.1109/IEMBS.1998.746954
Filename
746954
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