Title :
A vision system for inspection of ball bonds in integrated circuits
Author :
Khotanzad, Alireza ; Banerjee, Haimanti ; Srinath, Mandyam
Author_Institution :
Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
fDate :
30 Nov-2 Dec 1992
Abstract :
The paper describes a vision system for automatic inspection of the connecting part of the wire bond of an IC where the wire connects to the bond pad on the chip. It considers a popular type of such bonds known as `ball bond´. Using two-dimensional images taken from the top of the IC wafer, the system determines several geometric measures which are important in determining the quality of the bond. These measures include the boundary, length of major and minor axes of the best fitting ellipse and the center. The process utilizes automatic thresholding, morphological operations and geometric moments of the image. Success of the method is demonstrated through experimental studies on actual bonds
Keywords :
VLSI; automatic optical inspection; integrated circuit testing; monolithic integrated circuits; packaging; IC wafer; automatic thresholding; ball bond; bond pad; geometric measures; geometric moments; inspection; integrated circuits; morphological operations; two-dimensional images; vision system; wire bond; Bonding; Circuits; Humans; Inspection; Instruments; Joining processes; Machine vision; Semiconductor device manufacture; Semiconductor device measurement; Wire;
Conference_Titel :
Applications of Computer Vision, Proceedings, 1992., IEEE Workshop on
Conference_Location :
Palm Springs, CA
Print_ISBN :
0-8186-2840-5
DOI :
10.1109/ACV.1992.240300
