DocumentCode :
3336447
Title :
Experiment Study of Micro hot-embossing process using GC mold and PC substrate
Author :
Lan, Shuhuai ; Lee, Moongu ; Ni, Jun ; Moongu Lee ; Choi, Seogou
Author_Institution :
Dept. of Mech. Eng., Shanghai Jiao Tong Univ., Shanghai
fYear :
2008
fDate :
9-11 April 2008
Firstpage :
377
Lastpage :
382
Abstract :
Micro semi-pyramidal pattern arrays were directly created on the commercially available polymer substrate (polycarbonate, PC) by pressing a glassy carbon (GC) mold in the hot-embossing process with self-made hot-embossing machine. The micro feature of negative cavity on the GC mold was fabricated by Focus Ion Beam technique (FIB). The cavities were approximately 65times70 um at width and 42 um at depth. The space periodicity between the micro cavities is about 120times120 um. By adopting an orthogonal design of experiment method with four parameters of the micro hot-embossing process, each one at three levels was studied. The key parameters which have important influence to the forming result, such as embossing force, embossing temperature, heating time and force holding time were studied. Good forming result was obtained by using a set of optimal parameters according to analysis of experiment data.
Keywords :
design of experiments; embossing; glass; heating; hot working; ion beam effects; micromechanics; moulding; polymers; pressing; production equipment; focus ion beam technique; force holding time; forming process; glassy carbon mold; heating time; hot-embossing machine; micro hot-embossing process; microsemipyramidal pattern arrays; orthogonal design of experiment method; polycarbonate substrate; pressing; Design methodology; Embossing; Heating; Ion beams; Manufacturing processes; Mechanical engineering; Nanobioscience; Optical device fabrication; Polymers; Temperature; Design of experiment method; GC mold; Micro hot-embossing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Smart Manufacturing Application, 2008. ICSMA 2008. International Conference on
Conference_Location :
Gyeonggi-do
Print_ISBN :
978-89-950038-8-6
Electronic_ISBN :
978-89-962150-0-4
Type :
conf
DOI :
10.1109/ICSMA.2008.4505556
Filename :
4505556
Link To Document :
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