Title :
High transconductance 0.1 /spl mu/m Ge/Si/sub 0.4/Ge/sub 0.6/ Schottky-gated p-MODFETs
Author :
Hammond, R. ; Koester, S.J. ; Chu, J.O.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
Summary form only given. In recent years, the enhanced electron and hole mobilities demonstrated in strained-layer Si/SiGe heterostructures have led to dramatic improvements in the dc and rf performance of modulation-doped field-effect transistors (MODFETs). The most dramatic advances have occurred in p-MODFETs, where high-speed, low-power devices have been fabricated that rival the performance of n-type devices. In the present work, we report the fabrication and characterization of self-aligned Ge-channel p-MODFETs that exhibit superior dc performance compared to previous alloy-channel and pure Ge-channel results reported to date.
Keywords :
Ge-Si alloys; electron mobility; elemental semiconductors; germanium; high electron mobility transistors; hole mobility; low-power electronics; semiconductor device measurement; semiconductor epitaxial layers; semiconductor growth; semiconductor materials; vapour phase epitaxial growth; 0.1 micron; Ge-Si/sub 0.4/Ge/sub 0.6/; Schottky-gated p-MODFETs; electron mobilities; high-speed devices; hole mobilities; low-power devices; modulation-doped field-effect transistors; self-aligned Ge-channel p-MODFETs; strained-layer heterostructures; Charge carrier processes; Electron mobility; Epitaxial layers; FETs; Fabrication; Germanium silicon alloys; HEMTs; MODFETs; Silicon germanium; Transconductance;
Conference_Titel :
Device Research Conference Digest, 1999 57th Annual
Conference_Location :
Santa Barbara, CA, USA
Print_ISBN :
0-7803-5170-3
DOI :
10.1109/DRC.1999.806362