• DocumentCode
    3336673
  • Title

    Improving pixel detectors: Active area optimization and high temperature annealing

  • Author

    Fadeyev, Vitaliy ; Gerling, Mark ; Wright, John ; Maddock, Patrick ; Betancourt, Christopher ; Hurley, Ford ; Sadrozinski, Hartmut F W

  • Author_Institution
    Santa Cruz Inst. for Particle Phys., Santa Cruz, CA, USA
  • fYear
    2009
  • fDate
    Oct. 24 2009-Nov. 1 2009
  • Firstpage
    1674
  • Lastpage
    1677
  • Abstract
    The existing pixel tracking detectors of ATLAS and CMS experiments will have to be replaced after LHC luminosity upgrade (super-LHC or sLHC), due to increased radiation level and tracking performance requirements. We are studying device active area re-optimization by cutting away dead area and some of the guard rings of existing sensors. Performance of the cut sensors will be described. We also present a feasibility study of operating irradiated silicon sensors after extreme temperature excursion characteristic of a standard bump-bonding process. This is relevant for high dose radiation studies before a sLHC-quality readout ASIC is developed.
  • Keywords
    annealing; bonding processes; position sensitive particle detectors; semiconductor counters; semiconductor technology; surface treatment; ATLAS pixel tracking detectors; CMS pixel tracking detectors; LHC luminosity upgrade; active area optimisation; bump-bonding process; extreme temperature excursion; high temperature annealing; irradiated silicon sensors; pixel detectors; sLHC; sensor guard rings; super-LHC; Annealing; Application specific integrated circuits; Collision mitigation; Detectors; Large Hadron Collider; Laser beam cutting; Mechanical sensors; Sensor phenomena and characterization; Silicon; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium Conference Record (NSS/MIC), 2009 IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    1095-7863
  • Print_ISBN
    978-1-4244-3961-4
  • Electronic_ISBN
    1095-7863
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2009.5402232
  • Filename
    5402232