DocumentCode
333681
Title
Numerical estimation of skull and cortex boundaries from scalp geometry
Author
Haque, Hasnine A. ; Musha, Toshimitsu ; Nakajima, Masayuki
Author_Institution
Graduate Sch. of Inf. Sci. & Eng., Tokyo Inst. of Technol., Japan
Volume
4
fYear
1998
fDate
29 Oct-1 Nov 1998
Firstpage
2171
Abstract
One of the most sophisticated means of dipole localization is based on a multi-compartment head model in which the inhomogeneity of the electric conductivity of the head is approximated by compartments of uniform conductors. Compartments usually refer to scalp, skull, cerebrospinal fluid (CSF) and brain cortex. The CSF layer in normal subjects is thin and can be neglected in dipole localization to good approximation. The authors aim at constructing the so-called SSB head model in which the CSF layer is neglected. To construct this model 3D MR images or 3D X-ray CT images are necessary. These images, however, are not easy to get, and the authors tried to estimate geometrical shapes of these compartments from a head geometry which is easily measured with a 3D digitizer. The authors have examined the statistical properties of the head structure through 3D MR images of 12 normal subjects, and the estimation error in their method is 1.5 mm for the skull and 2.2 mm for the cortex
Keywords
biomedical MRI; brain models; computerised tomography; edge detection; medical image processing; orthopaedics; 3D digitizer; CT; MRI; cerebrospinal fluid; cortex boundaries; dipole localization; electric conductivity inhomogeneity; estimation error; geometrical shapes estimation; multicompartment head model; numerical estimation; scalp geometry; skull boundaries; Amplitude modulation; Brain modeling; Computed tomography; Conductivity; Conductors; Head; Scalp; Shape measurement; Skull; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location
Hong Kong
ISSN
1094-687X
Print_ISBN
0-7803-5164-9
Type
conf
DOI
10.1109/IEMBS.1998.747040
Filename
747040
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