• DocumentCode
    333681
  • Title

    Numerical estimation of skull and cortex boundaries from scalp geometry

  • Author

    Haque, Hasnine A. ; Musha, Toshimitsu ; Nakajima, Masayuki

  • Author_Institution
    Graduate Sch. of Inf. Sci. & Eng., Tokyo Inst. of Technol., Japan
  • Volume
    4
  • fYear
    1998
  • fDate
    29 Oct-1 Nov 1998
  • Firstpage
    2171
  • Abstract
    One of the most sophisticated means of dipole localization is based on a multi-compartment head model in which the inhomogeneity of the electric conductivity of the head is approximated by compartments of uniform conductors. Compartments usually refer to scalp, skull, cerebrospinal fluid (CSF) and brain cortex. The CSF layer in normal subjects is thin and can be neglected in dipole localization to good approximation. The authors aim at constructing the so-called SSB head model in which the CSF layer is neglected. To construct this model 3D MR images or 3D X-ray CT images are necessary. These images, however, are not easy to get, and the authors tried to estimate geometrical shapes of these compartments from a head geometry which is easily measured with a 3D digitizer. The authors have examined the statistical properties of the head structure through 3D MR images of 12 normal subjects, and the estimation error in their method is 1.5 mm for the skull and 2.2 mm for the cortex
  • Keywords
    biomedical MRI; brain models; computerised tomography; edge detection; medical image processing; orthopaedics; 3D digitizer; CT; MRI; cerebrospinal fluid; cortex boundaries; dipole localization; electric conductivity inhomogeneity; estimation error; geometrical shapes estimation; multicompartment head model; numerical estimation; scalp geometry; skull boundaries; Amplitude modulation; Brain modeling; Computed tomography; Conductivity; Conductors; Head; Scalp; Shape measurement; Skull; X-ray imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
  • Conference_Location
    Hong Kong
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-5164-9
  • Type

    conf

  • DOI
    10.1109/IEMBS.1998.747040
  • Filename
    747040