DocumentCode
333693
Title
Silicon sieve electrodes for neural implants-in vitro characterisation and in vivo recordings
Author
Wallman, L. ; Levinsson, A. ; Schouenborg, J. ; Holmberg, H. ; Montelius, L. ; Danielsen, N. ; Laurell, T.
Author_Institution
Dept. of Electr. Meas., Lund Univ., Sweden
Volume
4
fYear
1998
fDate
29 Oct-1 Nov 1998
Firstpage
2225
Abstract
An in vitro model was developed to characterise the electrical properties of silicon microfabricated recording electrodes, using a Cu-wire mimicing a neural signal source. Phosphorous doped electrodes were used to achieve an all silicon device. The model was used to study signal amplitude as a function of distance between the electrode surface and the signal source. Signal crosstalk to neighbouring electrodes on the chips were recorded. The crosstalk was found to be 6 dB using an external reference electrode. Improvements were accomplished with. An on chip reference electrode giving an amplitude crosstalk suppression of 20 dB. It was found that the amplitude decreased by a factor of 2 at a distance of 50 μm between the electrode surface and the signal source. Sieve electrodes were also implanted in the rat sciatic nerve and following a 10 week nerve regeneration period the dorsal and ventral (L5) roots in the spinal cord were stimulated. Compound action potentials were recorded via the chip. Lower leg muscle contraction activity was also induced by stimulating the regenerated sciatic nerve via the sieve electrode
Keywords
bioelectric potentials; biomedical electrodes; neurophysiology; prosthetics; silicon; 10 w; 10 week nerve regeneration period; 50 mum; Cu; Cu-wire; Si; amplitude crosstalk suppression; dorsal roots; in vitro characterisation; in vivo recordings; lower leg muscle contraction; neural implants; on chip reference electrode; rat sciatic nerve; signal crosstalk; signal source; silicon sieve electrodes; spinal cord; ventral roots; Biological system modeling; Crosstalk; Electrodes; Extremities; Implants; In vitro; In vivo; Neural prosthesis; Silicon; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location
Hong Kong
ISSN
1094-687X
Print_ISBN
0-7803-5164-9
Type
conf
DOI
10.1109/IEMBS.1998.747054
Filename
747054
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