FIB-Sputtering Characteristic of Mold Material and Nano Grid Pattern Fabrication

Recently, FIB-Sputtering process has been applied to many micro-manufacturing fields such as semi-conductor industries, display industries and IT industries etc. because it is available to fabricate the micro 3D shape structure directly and more effectively than other machining processes. However, currently FIB is not applied in the fabrication of this micro mold because of some problems such as redeposition and charging effect relating to shape accuracy and productivity. Furthermore, the prediction of the material removal rate is difficult for micro structure fabrication. In this paper, we studied the FIB-Sputtering rate according to mold materials. As well, surface roughness characteristics were analyzed for micro and nano mold fabrication. Si wafer, G.C (glassy carbon), STAVAX, and DLC that have been normally considered as good micro or nano mold materials were used in this study. And also we have known the pattern by pattern procedure has more good fib-sputtering shape than layer by layer procedure.