DocumentCode :
3337309
Title :
Study on Gripping Large-size FPD Glass Substrates
Author :
Lee, Eungki ; Sookhan Kim ; Minseok Kim ; Hong, Sungchul ; In, Jaejun ; Kang, Jinsung
Author_Institution :
Div. of Mech. & Automotive Eng., Kongju Univ., Seoul
fYear :
2008
fDate :
9-11 April 2008
Firstpage :
39
Lastpage :
42
Abstract :
The mother glass substrate in FPD is needed to be enlarging for raising its productivity itself as well as the realization of the world-widely TV. Especially the mother glass in OLED is needed uniformly distributed gripping force to handle deflection of the glass. Because large-size glass substrate has some difficulties regarding its deflection during handling operation due to its thinness (0.5-0.7t) which is not even enough to stand its mass itself. This study aims to demonstrate a new solution of these difficulties through clamping and bending boundary conditions of the hinge type, which help to minimize the deflection of the glass substrate. The experiments had also been carried out to verify the proposed method for minimizing the glass-deflection. This new design of glass substrate handler may be useful in manufacturing the large OLED displays.
Keywords :
bending; clamps; design engineering; display devices; fasteners; glass manufacture; grippers; organic light emitting diodes; production engineering computing; OLED displays; bending; clamping; glass handling operation; glass-deflection; gripping force; hinge type; large-size FPD glass substrates; organic light-emitting diode; Boundary conditions; Clamps; Differential equations; Elasticity; Fasteners; Flat panel displays; Glass manufacturing; Integral equations; Organic light emitting diodes; Productivity; OLED (organic light-emitting diode); bending; boundary condition; clamping; deflection; glass handler;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Smart Manufacturing Application, 2008. ICSMA 2008. International Conference on
Conference_Location :
Gyeonggi-do
Print_ISBN :
978-89-950038-8-6
Electronic_ISBN :
978-89-962150-0-4
Type :
conf
DOI :
10.1109/ICSMA.2008.4505609
Filename :
4505609
Link To Document :
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