• DocumentCode
    3337863
  • Title

    Electric Field Analysis for Micro-EDM Deburring Process

  • Author

    Byung Han Yoo ; Jeong, Young Hun ; Min, Byung-Kwon ; Lee, Sang Jo

  • Author_Institution
    Sch. of Mech. Eng., Yonsei Univ., Seoul
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    239
  • Lastpage
    242
  • Abstract
    Micro electrical discharge machining process is widely used for making small holes and machining micro molds. Recently, micro-EDM process was applied to the deburring process in the microdevices. Burrs at the edge of the devices were removed effectively with minimizing damage of machined surface. The electric field strength between the electrode and the workpiece was analyzed according to the geometry of burrs. The analyzed electric strength was compared to the dielectric strength of kerosene. The electrical discharge mechanism at the burr instead of the surface of the workpiece plane was explained by the electric field strength distribution. The characteristics of micro-EDM deburring process in the microdevices were studied. Adujusting the electrode tool position precisely, the burrs on the surface remained could be removed successfully. In this research, through the electric strength analysis, the applying the micro-EDM process to the deburring process was suggested.
  • Keywords
    deburring; electric strength; electrical discharge machining; electrodes; micromachining; micromechanical devices; burrs; electric field analysis; electric field strength; electric strength analysis; electrode tool position; micro molds; microEDM deburring process; microelectrical discharge machining; Automation; Conducting materials; Deburring; Dielectric breakdown; Electrodes; Machining; Mechanical engineering; Milling; Surface discharges; Surface finishing; deburring process; electric field strength; micro electrical discharge machining; microdevice;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Smart Manufacturing Application, 2008. ICSMA 2008. International Conference on
  • Conference_Location
    Gyeonggi-do
  • Print_ISBN
    978-89-950038-8-6
  • Electronic_ISBN
    978-89-962150-0-4
  • Type

    conf

  • DOI
    10.1109/ICSMA.2008.4505649
  • Filename
    4505649