DocumentCode
3337863
Title
Electric Field Analysis for Micro-EDM Deburring Process
Author
Byung Han Yoo ; Jeong, Young Hun ; Min, Byung-Kwon ; Lee, Sang Jo
Author_Institution
Sch. of Mech. Eng., Yonsei Univ., Seoul
fYear
2008
fDate
9-11 April 2008
Firstpage
239
Lastpage
242
Abstract
Micro electrical discharge machining process is widely used for making small holes and machining micro molds. Recently, micro-EDM process was applied to the deburring process in the microdevices. Burrs at the edge of the devices were removed effectively with minimizing damage of machined surface. The electric field strength between the electrode and the workpiece was analyzed according to the geometry of burrs. The analyzed electric strength was compared to the dielectric strength of kerosene. The electrical discharge mechanism at the burr instead of the surface of the workpiece plane was explained by the electric field strength distribution. The characteristics of micro-EDM deburring process in the microdevices were studied. Adujusting the electrode tool position precisely, the burrs on the surface remained could be removed successfully. In this research, through the electric strength analysis, the applying the micro-EDM process to the deburring process was suggested.
Keywords
deburring; electric strength; electrical discharge machining; electrodes; micromachining; micromechanical devices; burrs; electric field analysis; electric field strength; electric strength analysis; electrode tool position; micro molds; microEDM deburring process; microelectrical discharge machining; Automation; Conducting materials; Deburring; Dielectric breakdown; Electrodes; Machining; Mechanical engineering; Milling; Surface discharges; Surface finishing; deburring process; electric field strength; micro electrical discharge machining; microdevice;
fLanguage
English
Publisher
ieee
Conference_Titel
Smart Manufacturing Application, 2008. ICSMA 2008. International Conference on
Conference_Location
Gyeonggi-do
Print_ISBN
978-89-950038-8-6
Electronic_ISBN
978-89-962150-0-4
Type
conf
DOI
10.1109/ICSMA.2008.4505649
Filename
4505649
Link To Document