Title : 
Transient analysis of nonlinearly loaded arrangements consisting of thin wires and metallic patches
         
        
            Author : 
Deiseroth, K. ; Singer, H.
         
        
            Author_Institution : 
Tech. Univ. Hamburg-Harburg, Germany
         
        
        
        
        
        
            Abstract : 
A combined frequency and time domain procedure for the simulation of arbitrary nonlinearly loaded arrangements consisting of metallic patches and thin wires is presented. The time-invariant, linear part of the structure is analysed by means of the method of moments in the frequency domain while the characteristics of the nonlinear, time-variant elements are included via a convolution integral of Volterra-type in the time domain. The universal applicability of the algorithm to a large variety of EMC problems is demonstrated by means of a simulation example and the results are verified by measurements. Finally a procedure for the characterisation of one-port nonlinear devices up to high frequencies based on a nonlinear node analysis and interpolation is presented
         
        
            Keywords : 
Volterra equations; convolution; electromagnetic compatibility; interpolation; method of moments; nonlinear network analysis; time-frequency analysis; time-varying networks; transient analysis; EMC problems; Volterra-type convolution integral; combined frequency and time domain procedure; frequency domain procedure; interpolation; metallic patches; method of moments; nonlinear node analysis; nonlinearly loaded arrangements; one-port nonlinear devices; thin wires; time domain procedure; transient analysis; Circuit testing; Diodes; Electromagnetic compatibility; Finite difference methods; Frequency domain analysis; Power system transients; Protection; Time domain analysis; Transient analysis; Wires;
         
        
        
        
            Conference_Titel : 
Electromagnetic Compatibility, 1995. Symposium Record., 1995 IEEE International Symposium on
         
        
            Conference_Location : 
Atlanta, GA
         
        
            Print_ISBN : 
0-7803-3608-9
         
        
        
            DOI : 
10.1109/ISEMC.1995.523635