• DocumentCode
    3337900
  • Title

    Reduction of Overcut in the Electrochemical Discharge Machining Process Using a Side-insulated Electrode

  • Author

    Han, Min-Seop ; Min, Byung-Kwon ; Lee, Sang Jo

  • Author_Institution
    Dept. of Mech. Eng., Yonsei Univ., Seoul
  • fYear
    2008
  • fDate
    9-11 April 2008
  • Firstpage
    251
  • Lastpage
    254
  • Abstract
    Electrochemical discharge machining (ECDM) process utilizes the spark discharge produced by gas film formation during electrolysis. In conventional ECDM process precise control of the spark generation is difficult because of the randomness of gas film formation which results in the significant deterioration of process qualities such as excessive overcut, poor machining accuracy and low machining repeatability. The undesirable overcut phenomenon strictly hinders the dimensional miniaturization of ECDM process especially when the diameter of applied tool is much smaller than 100 mum. In this study a side insulated tool and dilute electrolyte concentration is proposed to reduce the undesirable overcut and thus, to improve the machining resolution of ECDM process. Experiments are conducted with various machining parameters, such as spark ignition voltage, electrolyte concentration and tool insulation. As a result the feasibility of miniaturization in ECDM process is successfully improved by reducing the excessive overcut phenomena.
  • Keywords
    electrochemical electrodes; electrochemical machining; electrolysis; electrolytes; ECDM process; dilute electrolyte concentration; electrochemical discharge machining; electrolysis; gas film formation; machining parameters; side-insulated electrode; spark discharge; spark ignition voltage; tool insulation; Electrochemical processes; Electrodes; Fabrication; Glass; Insulation; Machining; Process control; Sparks; Tungsten; Voltage; Glass machining; Microchannel; Overcut;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Smart Manufacturing Application, 2008. ICSMA 2008. International Conference on
  • Conference_Location
    Gyeonggi-do
  • Print_ISBN
    978-89-950038-8-6
  • Electronic_ISBN
    978-89-962150-0-4
  • Type

    conf

  • DOI
    10.1109/ICSMA.2008.4505652
  • Filename
    4505652