DocumentCode :
3337945
Title :
Delay Analysis of VLSI Interconnections Using the Diffusion Equation Model
Author :
Kahng, Andrew B. ; Muddu, Sudhak Ar
Author_Institution :
UCLA Computer Science Department, Los Angeles, CA
fYear :
1994
fDate :
6-10 June 1994
Firstpage :
563
Lastpage :
569
Abstract :
The traditional analysis of signal delay in a transmission line begins with a lossless LC representation, which yields a wave equation governing the system response; 2-port parameters are typically derived and the solution is obtained in the transform domain. In this paper, we begin with a distributed RC line model of the interconnect and analytically solve the resulting diffusion equation for the voltage response. A new closed form expression for voltage response is obtained by incorporating appropriate boundary conditions for interconnect delay analysis. Calculations of 50% and 90% delay times for various cases of interest (e.g., open-ended RC line) give substantially different estimates from those commonly cited in the literature, thus suggesting revised delay estimation methodologies and intuitions for the design of VLSI interconnects. The discussion furthermore provides a unifying treatment of the past three decades of RC interconnect delay analyses.
Keywords :
Boundary conditions; Delay estimation; Partial differential equations; Propagation delay; Propagation losses; Signal analysis; Transforms; Transmission lines; Very large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation, 1994. 31st Conference on
ISSN :
0738-100X
Print_ISBN :
0-89791-653-0
Type :
conf
DOI :
10.1109/DAC.1994.204167
Filename :
1600440
Link To Document :
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