DocumentCode
3338903
Title
Collection of papers presented at the 14th International Workshop on THERMal INvestigation of ICs and Systems
fYear
2008
fDate
24-26 Sept. 2008
Abstract
The following topics were dealt with: electronics cooling; CFD; MCAD; EDA; reliability; nanopack; sensors; LED.
Keywords
CAD; computational fluid dynamics; cooling; integrated circuit packaging; integrated circuit reliability; nanotechnology; standardisation; CFD; EDA; LED; MCAD; electronics cooling; nanopack; reliability; sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
Conference_Location
Rome
Print_ISBN
978-1-4244-3365-0
Type
conf
DOI
10.1109/THERMINIC.2008.4669862
Filename
4669862
Link To Document