Title :
Triangulation method for structure functions of multi-directional heat-flows
Author :
Codecasa, Lorenzo ; Amore, Dario D. ; Maffezzoni, Paolo
Author_Institution :
Politec. di Milano, Milan
Abstract :
In this paper previous results proposed by the authors for localizing defects in components and packages by means of structure functions in three-dimensional heat diffusion problems have been generalized. To this aim a novel traingulation approach is presented based on the use of structure functions corresponding to dinstinct heat sources.
Keywords :
RC circuits; electronics packaging; heat transfer; network analysis; thermal analysis; multidirectional heat-flows; short-circuited RC transmission line; structure functions; triangulation method; Capacitance; Electrical resistance measurement; Equations; Packaging; Power measurement; Power transmission lines; Resistance heating; Temperature measurement; Thermal conductivity; Thermal resistance;
Conference_Titel :
Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3365-0
Electronic_ISBN :
978-2-35500-008-9
DOI :
10.1109/THERMINIC.2008.4669870
