PCBs thermophysical properties in lead-free assembling process assessment

As elements of interconnection structures at level two in electronic packaging, the pads could be considered as a particular solution into a virtual space defined by the materials, geometry, surface finishes and substrate. The assembling processes emphasize the substrate contribution over thermal mass and heat transfer. Each of the pad particular solution defined in the design stage will have unique values of thermophysical properties (THP). In the paper it will be presented the results of the THP measurements for different types of PCBs having particular solutions defined by the pad finishes, geometry and substrate materials using ANTER equipments (FlashLine 3000 thermal diffusivity system and Unitherm1161V dilatometer type). Finally, scientific and practical conclusions shall be drawn in order to improve the quality, reliability and increase the energetic efficiency of the reflow soldering process.