Title :
Assessment of die attach quality by analysis of circuit thermal response spectrum
Author :
Janicki, M. ; Vermeersch, B. ; Banaszczyk, J. ; Kaminski, M. ; De Mey, G. ; Napieralsk, A.
Author_Institution :
Radon Inst. for Comput. & Appl. Math., Austrian Acad. of Sci., Linz
Abstract :
This paper investigates the possibility of assessing the die attach quality by the spectral analysis of the recorded device time response. The conducted analyses of the measured and the simulated time constant spectra of the thermal response allowed the explanation of the anomalous electrical oscillations observed during the operation of a power converter.
Keywords :
circuit oscillations; microassembling; power convertors; spectral analysis; circuit thermal response spectrum; die attach quality; electrical oscillations; power converter; recorded device time response; spectral analysis; Analytical models; Circuit analysis; Circuit simulation; Electric variables measurement; Microassembly; Power measurement; Spectral analysis; Thermal conductivity; Time factors; Time measurement;
Conference_Titel :
Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3365-0
Electronic_ISBN :
978-2-35500-008-9
DOI :
10.1109/THERMINIC.2008.4669876
