• DocumentCode
    3339309
  • Title

    A novel procedure and device to allow comprehensive characterization of power leds over a wide range of temperature

  • Author

    Molnár, Gábor ; Nagy, Gergely ; Szocs, Z.

  • Author_Institution
    Dept. of Electron Devices, Budapest Univ. of Technol. & Econ. (BUTE), Budapest
  • fYear
    2008
  • fDate
    24-26 Sept. 2008
  • Firstpage
    89
  • Lastpage
    92
  • Abstract
    LEDs are key elements in modern, energy efficient lighting solutions as well as impose some issues from thermal point of view, since light output and reliability both depend on LEDspsila junction temperature. A comprehensive and accurate measurement method is required and demanded by several leader LED manufacturers. Failing a proper combined thermal and radiometric/photometric characterization of LED light sources it is impossible to fulfill the reliability prescriptions for LEDs and to trust the lifetime estimation given in LED datasheets. Light output of LEDs is typically measured in integrating spheres. A key element in such a total flux measurement setup is the appropriate set of standard LEDs which are both current and temperature stabilized and are accompanied with certificate values of their own total flux traceable to primary etalons of national measurement laboratories. So far there are hardly any such standard LEDs available for the high power range. In this paper we describe the design of such a device (having 5 colors) and describe a modification of the substitution type total flux measurement method which is suitable for an automated, comprehensive measurement of LEDs over a wide range of operating conditions.
  • Keywords
    light emitting diodes; light sources; reliability; thermal analysis; LED junction temperature; LED light sources; flux measurement; integrating spheres; photometric characterization; power LED; radiometric characterization; Current measurement; Energy efficiency; LED lamps; Light emitting diodes; Light sources; Manufacturing; Photometry; Radiometry; Temperature dependence; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3365-0
  • Electronic_ISBN
    978-2-35500-008-9
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2008.4669885
  • Filename
    4669885